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Processes and active zones in oxygen-free atmospheres for the development of sustainable production techniques and manufacturing processes
All technically used inert gas and vacuum atmospheres still contain sufficient oxygen molecules, which lead to the rapid oxidation of metal surfaces. This limits the possibilities of many processing and joining processes. The Collaborative Research Center 1368 "Oxygen-free production" is based on the idea of adding a small amount of silane (a few ppm) to the inert gas argon. The silane reacts with the residual oxygen and water in the atmosphere and reduces the partial pressure of the oxygen to less than 10-23 bar. This partial pressure is equivalent to extremely high vacuums (XHV-adequate atmosphere). The CRC is concerned with the development and research of specific production processes for forming, shaping, joining, cutting and coating in an oxygen-free environment.
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Sub-project B04 "Adhesive-based assembly processes in an XHV-adequate atmosphere with deoxidized and oxidized joining partners"
Project leader: Prof. Dr. rer. nat. Wolfgang Maus-Friedrichs, Prof. Dr. Ing. Annika Raatz
Funding period: 01/2020 - 12/2027
Funding body: DFG
Researchers: M. Sc. Philipp Moritz, Dr. rer. nat. Lienhard Wegewitz
The project is carried out in cooperation with the Institute of Assembly Technology (match) at Leibniz Universität Hannover. Adhesive-based assembly processes are becoming increasingly important in industry, especially for temperature-sensitive components and hybrid material combinations of polymers and metals. In addition to purely mechanical force transmission, adhesives are increasingly fulfilling functional requirements, for example as corrosion protection or damping. The XHV-adequate atmosphere, in which purely metallic surfaces and fillers can be used, can potentially achieve improved functionalities and mechanical strength. The research in this project phase aims on the one hand to understand the effects of the XHV-adequate atmosphere on the bonding of hybrid polymer/metal composites. At the same time, the effects of deoxidized fillers and bonded part surfaces on electrical and thermal conductivity should also be known. The knowledge gained will be transferred to current challenges in adhesive bonding technology in order to provide bonded joints with improved mechanical, electrical and thermal properties and thus establish adhesive bonding in new fields of application.